The philosophy of the Retronix IC recovery process is built around industry standards, adopted by the largest IC manufacturers. For them, when you are soldering ICs to PCBs, temperature and time are your enemy. The higher the temperature, and the longer the profile, then the more likely damage is to be caused. Think of passing your wet finger through a candle flame, no damage. Then think about holding it there for a minute! IC Manufacturers state (as a rule) no more than 3 or 4 reflow cycles should be carried out on an IC, but up to that number is fine:
Micron - "The maximum number of reflows is defined as three...product guarantees may be invalidated" (Ref 1.)
Xilinx - "Pg.11 JEDEC STD-20 compliant Packages capable of withstanding high reflow temperature rating (245 C-260 C) for 3 reflow cycles" (Ref 2.)
INTEL - "Many BGAs (including Intel BGAs) are rated for 3 reflow cycles" (Ref 3.)
Intel specifies two more points which are relevant, in the above referenced document, point 184.108.40.206 specifies, that the profile goes above 154 deg. after approx 1.9 minutes, and does not come below 154 deg. again till about 6.4 minutes. So it is above that temperature for approx. 4.5 minutes, moreover some profiles are even longer than this.
Keeping the above standards in mind, the Retronix IC Rescue process is different and unique as it manages to stay within all the stated manufacturers specifications, much shorter in terms of temperature and time, safe and well below stated reflow profiles.
Following comparison shows the traditional method to the Retronix method, and how the Retronix IC recovery method is changing the landscape of the component recovery market.
The first time the component goes onto a PCB it has gone through a reflow profile, therefore the count starts from 1.
As can be seen from the comparison above:
The Retronix IC Rescue method is well within the manufacturers specifications, the process is automated, controlled and completely safe.
Additional benefits of Retronix IC Rescue method include an automatic wash which makes sure each IC is clean, a mechanical test to verify functionality, including curve trace test, key functional test and memory test. A solderability test and XRF test to verify composition of leg or ball.
Watch a video on the IC recovery process:
For more information on the reflow profiles and on our IC recovery process do contact us and we will be happy to set up a meeting to discuss more on this process - (Click Here)
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