Retronix has taken delivery of its custom developed high
capacity laser balling and reballing system. Developed in partnership with
Retronix by a world renowned laser company, the new laser system will be
capable of reballing multiple ICs over a wide work area. Retronix is finalising
the development of the new laser system and will partner with existing
customers to finalise its trialling and commissioning. The new laser represents
a significant investment by Retronix and will reinforce its leadership in the
market for balling and reballing ICs.
Wednesday, 30 January 2013
Retronix Successfully Trials Plastic Core Solder Balls
Plastic Core Solder Balls (PCSB) provide a method of ensuring stand-off height between an IC package and the substrate or PCB. Inside the SnAg sphere is a polymer core buffered by nickel and copper layers. Standard Pb free reflow profiles can be used to attach the PCSBs unlike the alternative method of High Melting Point (HMP) spheres.
For RF and microwave applications, PCSBs can provide a predictable and well controlled path length and inductance solution for package attachment to PCBs.
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