Plastic Core Solder Balls (PCSB) provide a method of ensuring stand-off height between an IC package and the substrate or PCB. Inside the SnAg sphere is a polymer core buffered by nickel and copper layers. Standard Pb free reflow profiles can be used to attach the PCSBs unlike the alternative method of High Melting Point (HMP) spheres.
For RF and microwave applications, PCSBs can provide a predictable and well controlled path length and inductance solution for package attachment to PCBs.
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