LCC on PCB caused thermal imbalance and it lead to solder joint failures

A customer was experiencing a high failure rate, during accelerated life testing on one of their PCBs. The same fault was causing the problem each time. 

The problem was of cracking solder joint(s) on a Leaded Chip Carrier (LCC) which was soldered directly on the PCB. It was discovered that the LCC created a lot of heat, with no space under the component to dissipate the heat. The thermal imbalance between the IC and the PCB caused the solder joint to fail. 

To fix the problem Retronix fitted Plastic Core Solder Spheres (PCSS) to the pads, which don't collapse.

The PCSS created enough 'standoff' between the IC and the PCB which allowed the heat to dissipate. Also having the exact same spheres on the exact same pads also guaranteed the RF inductance on the part.

This solution reduced the failure rate on the PCB by a factor of 10, eliminating the issue as a weak spot on the component.

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Retronix carries out successful underfill removal from a cellphone pcb

Retronix recently carried out successful underfill removal from a cellphone pcb that had to have a chip replaced, however the pcb was underefilled. Also the chip was under a can and was densely populated

We removed the can, then the damaged chip, then the underfill that was under the chip, and surrounding it.

After cleaning up the pads we replaced the chip and tested the pcb. When it passed we replaced the underfill, replaced the can and retested it to ensure the fix was successful

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Retronix Successfully Trials Plastic Core Solder Balls

Plastic Core Solder Balls (PCSB) provide a method of ensuring stand-off height between an IC package and the substrate or PCB. Inside the SnAg sphere is a polymer core buffered by nickel  and copper layers.  Standard Pb free reflow profiles can be used to attach the PCSBs unlike the alternative method of High Melting Point (HMP) spheres.

For RF and microwave applications, PCSBs can provide a predictable and well controlled path length and inductance solution for package attachment to PCBs.

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