Showing posts with label recycle ICs. Show all posts
Showing posts with label recycle ICs. Show all posts

Tuesday, 3 September 2013

Failed PCB's - What happens to the electronic components mounted on them?

It is a fact that there will always be a certain number of failures when PCB's are manufactured and this is normal due to the nature of manufacturing processes. Typical causes that can cause failures are:

1) Paste issues
2) Raw PCB faults
3) Rogue Solder joints

These faults mentioned above are the first indicator that the components mounted on these PCB's may be good, since they have nothing to do with the faults. Therefore in all probability the ICs may be brand new, unused and in perfect working order.

But sometimes company policy states that these failed PCB's be send straight to landfill and recycled, this leaves a lot of potential threats, as certain people with vested interests may get the opportunity to counterfeit these components by using the scrap material from these landfills, also in some cases be sold faulty or completely degraded to unsuspecting customers who buy and implement them in their supply chain leading to  huge problems later to deal with.

  Picture used for representation purposes only
Companies were taking this risk of sending the failed PCBs straight to landfill since there was no safe way of recovering these perfectly good components from PCBs for re-use. However recently there is a process developed that can recover these components for re-use in a very safe manner and without reflow cycles, and this is certainly a much better and economical way to recycle them than to throw the full unit away.

When new components are scarce, as is often the case, their recovery becomes even more important and even more profitable. The risk of dealing in counterfeit components has increased with the 2012 US National Defence Authorization Act. As this global issue becomes more and more of a problem, the ramifications, sentences and fines are becoming increasingly severe. Therefore the best option is to recover this ICs in a safe manner for re-use.

Here is a small demonstration of the process :

          

By recovering electronic components, up to 50 times the value can be realised from the scrap. The treated scrap, with components removed, could then be sent to any recycler, thereby also eliminating counterfeiting and the re-circulation of faulty and degraded parts.

E   - info@retronix.com, sales@retronix.com

Wednesday, 15 August 2012

Counterfeit Alert: August 2012

W83977ATG (WINBOND)


A customer sent Retronix's testing department a large number of these Winbond W83977ATG components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused, but the evidence found by our testing team revealed that the parts were not compliant with standards set by IDEA-STD-1010B, Exhibit 46B Figure 12-79, Coplanarity Failures.

The parts arrived in non-moisture bags, meaning that if they were going to be used, they would need to be baked beforehand to remove any moisture. Some of the components which were visually inspected by the testing team at Retronix also showed signs of contamination. Upon opening the first bag of components, Retronix's testing team noticed obvious damage to the top left component.

Top tray of first bag of components - visible damage to pins on top left device
Top tray of first bag opened - visible damage to top left device.
Closer inspection of the devices uncovered contamination on the back of the component and damage to the pins. 

Left - contamination on back of device. Right - pin damage to device.
Left - contamination on back of device. Right - pin damage to device.
Although some of the components displayed differing pin 1 indents, this may have been because the batches had mixed datecodes. This theory would need to be verified by Winbond.

THE VERDICT

Due to the initial results of the visual inspection, as well as the more detailed results - which revealed pin damage and contamination - Retronix's testing team has ruled the components to be in "non-conforming condition."

CS5530AUCE (National Semiconductor)


Retronix's testing department were sent CS5530AUCE Geode components with the request that they be visually inspected before use, much like the above Winbond case. These components were also sold as new and unused. 

But as soon as the testing department opened the box containing the components, they knew that these components were not what they said on the label. As you can see, although these components are on the same tray and have the same markings, they have different pin 1 indents and different top side edges.

The visible differences in the shapes and pin indents of the devices.
Upon closer inspection, Retronix's testing team discovered that the components had several scratch marks on their surfaces and signs of liquid contamination on the solder spheres.

Evidence of contamination and reballing on Geode components.
Left - scratches and evidence of re-balling. Right - liquid contamination on spheres.
 The CS5530AUCE Geode components also displayed evidence of being re-balled.

THE VERDICT


The visual inspection revealed a number of anomalies and the more detailed results of the tests uncovered yet more unusual features in these components, such as scratches and sphere contamination. Accordingly, Retronix's testing team has ruled the components to be in "non-conforming condition."

MPC866PVR133A (FREESCALE)


A customer sent Retronix's testing team a batch of Freescale MPC866PVR133A components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused.

When inspecting the packaging that the components had been delivered to Retronix's customer in, the testing team discovered that the label contained no manufacturer information or logo. 

Packaging label with missing information and logo
Packaging label is missing manufacturer's logo and information.

The components were then removed from the packaging and examined visually. This inspection uncovered a problem in the device's solder spheres - the spheres were scratched from underneath.

Devices show scratches beneath solder spheres
Visual inspection at Retronix uncovered scratches beneath solder spheres.
The only way that scratches beneath solder spheres can occur is if the solder spheres have been removed, meaning that it is very likely that this component had been re-balled - despite the fact that it was sold to our customer as "new and unused."

Further testing by Retronix also revealed that the device's solder spheres had evidence of contamination. Unfortunately, this was not the last of the component's flaws - the tests also showed that different sizes of solder sphere had been used to reball the device.

Solder sphere contamination and different sized solder spheres
Left - solder sphere contamination. Right - different sphere sizes used.
Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres.

THE VERDICT


Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres. This, coupled with the poor packaging which the components arrived in, has led Retronix's testing department to the conclusion that these components are "suspect counterfeit."

Worried about the authenticity of your components? Retronix can help

Wednesday, 30 May 2012

Investing in the Future: Automated Re-tinning

Importance of Re-tinning


In the PCB industry, the importance of re-tinning components prior to assembly is widely recognised. The way in which the re-tinning process is carried out is often crucial to the reliability of the components. Operator errors can cause damage to fine pitch leads and produce inconsistent results, so it is essential that the re-tinning process is automated.

Automated Processes for Optimal Results


Retronix's specialised services are designed to provide our customers with the most reliable and consistent results possible. With this in mind, we are pleased to announce that we have given our final sign off on our brand-new automated re-tinning machine!

Retronix's Operations Manager, Calum Drummond, receives final sign-off certificate from ACE Production Technology's President, Alan Cable.

The machine is an LTS-QFP system which is being custom built to our specifications which will provide automated re-tinning processing in accordance with ANSI/GEIA-STD-0006-2008 standards. It is equipped with:

  • Articulated vacuum pick-up head
  • Matrix tray (JEDEC)
  • Camera centring station
  • Lead alloy compatible solder pots (x2)
  • Fluxing station
  • Preheating station
  • Washing station
  • Drying station 

This "hands off" approach will allow for automated solder dip coating of fine pitch QFPs and similar devices and will produce consistently reliable results. 

Retronix's Guarantee


All components which pass through Retronix are subjected to thorough automated optical inspection testing and you only pay for the components which PASS our strict inspection criteria. 

To find out more about our component re-tinning services, please visit our website

Monday, 28 May 2012

Retronix Leads with Revolutionary Process

Unique and Innovative Process


Retronix's proven IC recovery process is the ONLY way to safely recover ICs from faulty and obsolete PCBs. Every day, companies waste huge amounts of money by scrapping faulty PCBs rather than recycling them. Why? Because there has never been a risk-free and reliable way to recover high-value ICs - until now.

IC manufacturers' specifications state that components can be subjected to no more than three reflow cycles. Our process allows us to safely remove and refurbish components with zero reflow cycles.

Comparison of current IC recovery processes and Retronix's IC recovery process.

Benefits of Recycling ICs


When PCBs fail in assembly, it is mainly due to process issues such as defective solder joints and raw PCB faults rather than silicon faults. Recycling ICs from failed PCBs with Retronix allows you to:

  • SLASH PRODUCTION COSTS - By recovering and re-using high-value ICs, you can save up to 80% of the cost of scrap and obsolete PCBs
  • FIND RARE COMPONENTS - Recovering ICs gives you with a new source of rare components. Retronix can recover scarce components from faulty or obsolete PCBs, providing you with a supply of safe and authentic ICs
  • BEAT COUNTERFEITING CONCERNS - The counterfeit industry is growing at an alarming rate. Removing and refurbishing components with Retronix prevents parts from entering the grey market and allows them to be thoroughly tested and certified (providing they pass our strict standards) before re-use or resale
  • REDUCE LANDFILL MATERIAL - Recycling components (which often contain harmful chemicals) rather than sending them to landfill doesn't just save you money - it also saves the environment
Read more about how Retronix's revolutionary process can help you recover ICs safely and save you money.