Showing posts with label counterfeiting. Show all posts
Showing posts with label counterfeiting. Show all posts

Wednesday, 17 July 2013

High Reliability industries are vulnerable to counterfeit ICs

High reliability industries such as the Defence, Medical, Aerospace, Oil & Gas sectors rely on electronic parts that are no longer produced by the original manufacturers or even sold by their authorised distributors. That reliance is based, in part, on the long life cycles of these systems. An electronic part may be manufactured for two years, but many defence, medical and aerospace systems which use these parts may be in service for more than two decades. Older components often need to be properly tested and would require retinning to avoid solderability issues like tin whisker.


These high reliability industries are critically dependent on a technology that obsoletes itself every few years or even faster in some cases, is made in locations which are not secure and over which they have no market share influence. 

To source scarce parts, purchasers in these high reliability industries often buy from independent distributors or brokers. This introduces high risk of faulty or counterfeit components being acquired.



E   - info@retronix.com, sales@retronix.com
Know more about our Automated Retinning (Click here)

Wednesday, 7 November 2012

Retronix Anti-Counterfeit IC Testing: Eliminating the risk for ICs to fail in the field


Retronix was contacted by a broker based in Germany who had bought some scarce ICs from China that were needed for a client. The client did not want to buy from China but did not have any other options.

When the ICs arrived in Germany, they knew there was an issue:
  •          They were not packed properly or vacuum sealed and
  •          There were obvious signs of damage and flux residue 

Unsure of what to do, they contacted Retronix and sent us the ICs for review.

There were 942 pieces in total. We confirmed there was no attempt to counterfeit the ICs by blacktopping, but there was some damage evident. We immediately removed 121 pieces from the stock for severe body damage and popcorning.

The remaining ICs were checked for the correct alloy, and had the solder on their terminations refreshed, then cleaned.

The ICs were then electrically tested, and 739 passed, and were deemed ok for assembly.

They were returned to the client and subsequently placed on PCBs. Three PCBs failed due to the IC Retronix refurbished, but when replaced the PCBs still failed, so it’s debatable whether the fault was that IC.

The remaining PCBs had no issue with the part.

However if the customer had just placed the ICs without sending them to Retronix, then  203 PCBs would have immediately failed, or worse, failed soon in the field.

If you want to learn more, please contact us here

Watch the video for IC Testing here





Wednesday, 15 August 2012

Counterfeit Alert: August 2012

W83977ATG (WINBOND)


A customer sent Retronix's testing department a large number of these Winbond W83977ATG components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused, but the evidence found by our testing team revealed that the parts were not compliant with standards set by IDEA-STD-1010B, Exhibit 46B Figure 12-79, Coplanarity Failures.

The parts arrived in non-moisture bags, meaning that if they were going to be used, they would need to be baked beforehand to remove any moisture. Some of the components which were visually inspected by the testing team at Retronix also showed signs of contamination. Upon opening the first bag of components, Retronix's testing team noticed obvious damage to the top left component.

Top tray of first bag of components - visible damage to pins on top left device
Top tray of first bag opened - visible damage to top left device.
Closer inspection of the devices uncovered contamination on the back of the component and damage to the pins. 

Left - contamination on back of device. Right - pin damage to device.
Left - contamination on back of device. Right - pin damage to device.
Although some of the components displayed differing pin 1 indents, this may have been because the batches had mixed datecodes. This theory would need to be verified by Winbond.

THE VERDICT

Due to the initial results of the visual inspection, as well as the more detailed results - which revealed pin damage and contamination - Retronix's testing team has ruled the components to be in "non-conforming condition."

CS5530AUCE (National Semiconductor)


Retronix's testing department were sent CS5530AUCE Geode components with the request that they be visually inspected before use, much like the above Winbond case. These components were also sold as new and unused. 

But as soon as the testing department opened the box containing the components, they knew that these components were not what they said on the label. As you can see, although these components are on the same tray and have the same markings, they have different pin 1 indents and different top side edges.

The visible differences in the shapes and pin indents of the devices.
Upon closer inspection, Retronix's testing team discovered that the components had several scratch marks on their surfaces and signs of liquid contamination on the solder spheres.

Evidence of contamination and reballing on Geode components.
Left - scratches and evidence of re-balling. Right - liquid contamination on spheres.
 The CS5530AUCE Geode components also displayed evidence of being re-balled.

THE VERDICT


The visual inspection revealed a number of anomalies and the more detailed results of the tests uncovered yet more unusual features in these components, such as scratches and sphere contamination. Accordingly, Retronix's testing team has ruled the components to be in "non-conforming condition."

MPC866PVR133A (FREESCALE)


A customer sent Retronix's testing team a batch of Freescale MPC866PVR133A components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused.

When inspecting the packaging that the components had been delivered to Retronix's customer in, the testing team discovered that the label contained no manufacturer information or logo. 

Packaging label with missing information and logo
Packaging label is missing manufacturer's logo and information.

The components were then removed from the packaging and examined visually. This inspection uncovered a problem in the device's solder spheres - the spheres were scratched from underneath.

Devices show scratches beneath solder spheres
Visual inspection at Retronix uncovered scratches beneath solder spheres.
The only way that scratches beneath solder spheres can occur is if the solder spheres have been removed, meaning that it is very likely that this component had been re-balled - despite the fact that it was sold to our customer as "new and unused."

Further testing by Retronix also revealed that the device's solder spheres had evidence of contamination. Unfortunately, this was not the last of the component's flaws - the tests also showed that different sizes of solder sphere had been used to reball the device.

Solder sphere contamination and different sized solder spheres
Left - solder sphere contamination. Right - different sphere sizes used.
Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres.

THE VERDICT


Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres. This, coupled with the poor packaging which the components arrived in, has led Retronix's testing department to the conclusion that these components are "suspect counterfeit."

Worried about the authenticity of your components? Retronix can help. 

Monday, 25 June 2012

Counterfeit Alert: June 2012

LSI53C1000R (LSI)


During the initial visual inspection, our testing department became suspicious straight away - the manufacturer's name was spelt incorrectly on the components and the date codes were varied when they should not have been. The markings, which should state "LSI LOGIC," actually say "LSI LOGIG." Our Test Manager, Joe Maguire, contacted LSI about the components and they responded with:

Markings display "LSI LOGIG" rather than "LSI LOGIC."
"Sample parts of the LSI53C1000R that we have on hand in the quality archives show the part marking to only include the word 'LSI' - not 'LSI LOGIC'... There is nothing on file for a correction of the markings from LSI LOGIG to LSI LOGIC."


Further examination from Retronix's testing department revealed that the components had chipped edges, fibre contamination and scratches under the solder spheres - all tell-tale signs of counterfeiting.

Retronix's testing department discovered fibre contamination in the components.
To confirm their suspicions about the authenticity of the parts, our testing department carried out XRF tests. The XRF analysis results showed that all of the components tested had a Pb (lead) content of over 24%, meaning that they were leaded and not RoHS compliant.

THE VERDICT

The results of the visual inspections and XRF analysis, along with LSI's statement, led Retronix's testing department to the conclusion that the parts should be regarded as "suspect counterfeit."

GM71V65163CT-3 (HYNIX)


Visual inspections revealed that two of the Hynix components tested had different textures - one had a smooth surface and reflected light while the other was bumpy and dull in its appearance.

Following this discovery, the testing team at Retronix subjected the components to permanency marking tests. Using a mixture consisting of one part IPA and three parts mineral spirits, a wipe test was performed. This resulted in a slight fading of the markings.
Markings changed from "Hyundai" to "Hynix."
Wipe testing using acetone uncovered another issue with the components - the date codes had been altered. The acetone wipe test also proved that the components had been re-marked. Changing date codes and branding is another trick used by counterfeiters to mask the origins of inauthentic parts.

Hynix were formerly Hyundai, however these may have been rebranded by counterfeiters  in an attempt to pass them off as authentic.

THE VERDICT

Due to the differences in surface appearance between components and the altering of the date codes and branding, Retronix's testing team has classed these as "suspect counterfeit."

MT29F08G08AAWP (MICRON)


Upon initial inspection, there are no obvious attempts at re-marking or re-packaging. However, Retronix's testing team notes that the markings on the die are Intel, not Micron. 

After further investigation through de-cap testing, it is discovered that while the device is marked as a Micron 8GB device, the die is marked as an Intel 16GB device. Furthermore, the date code on the device is 2009, week 16, while the date code on the die is 2008.

The true origins of the device are revealed through de-cap testing.
Retronix's testing department then used a programming software which is compatible with the MT29F08G08AAWP device to determine its unique ID code. This is a simple test which any genuine component would easily pass. The results proved that the device code was not authentic.
After contacting Micron about the component, our team received the following statement, confirming their suspicions about the device:

"The Micron part number is for an obsolete product and the die inside the package is for a different part."

THE VERDICT

Although this component did not display any external signs of tampering, the de-cap testing and incorrect ID code - along with Micron's statement - have allowed Retronix to confirm that this component is most definitely a counterfeit device.

Worried about the authenticity of your components? Retronix can help. 

Monday, 28 May 2012

Combating Counterfeit

Evolution of the Counterfeit Trade


It's the three words every purchasing department dreads - "the grey market."

Counterfeit electronic components have been making their way to the UK market for some time now and it is estimated that 95% of these unsafe and unreliable parts are arriving from Asia - a recent study revealed that the counterfeit industry accounts for 8% of China's gross domestic profit. The Chinese counterfeit market is becoming more and more sophisticated and those involved are spending vast amounts of time and money on developing new ways to "fake" components.

Components being removed from PCBs in China. © Kevin Lee/Getty Images 
Most CEMs, franchised brokers and non-franchised brokers have had some experience of counterfeit components in the past. Using these parts can lead to massive financial liability as well as loss of reputation - it is believed that counterfeiting costs the semiconductor industry around $7.5 billion every year in lost revenue.

Combating Counterfeit Worldwide


There are ways to stop the spread of counterfeit components. 

Retronix has been at the forefront of the "combating counterfeit" initiative for a number of years and has recently invested significantly in state of the art testing equipment to help in the fight to stop counterfeit components reaching production lines all over the globe.

Ensuring Authenticity of Components


For Retronix's strategy to be effective, it is vital for the purchasing professionals, distributors and brokers to become part of the fight and use Retronix's services as the first line of defence. Send your grey market components to Retronix for testing before you purchase them and, provided that they pass our scrupulous testing process, you will be able to hand them over to your customer with our certificate of authenticity.

Retronix has also developed a revolutionary process that allows us to recover components safely from obsolete PCBs without the component die reaching reflow temperatures. Apart from the obvious cost savings, this also ensures that the history of the component is traceable - meaning that you have no doubts about their authenticity.

All components that are recovered using the Retronix method are tested, baked, packaged in tape and reel or waffle trays then vacuum sealed. Working to IDEA-STD-1010-B standard, Retronix offers various tests including:

  • Visual Inspection
  • Acid Wipe Test (examining component for changes to screen printing)
  • Curve Trace Test (powered and un-powered)
  • Key Functional Test
  • De-capsulation
  • Ionic Contamination Test
  • Solderability Test
  • X-Ray
  • XRF    

We know that careful and thorough testing combined with our unique component recovery process will help in the fight against counterfeiting and ensure that you provide your customers with authentic and reliable components. To find out more about what Retronix can offer, please visit our website or email one of our team members.