Failed PCB's - What happens to the electronic components mounted on them?

It is a fact that there will always be a certain number of failures when PCB's are manufactured and this is normal due to the nature of manufacturing processes. Typical causes that can cause failures are:

1) Paste issues

2) Raw PCB faults

3) Rogue Solder joints

These faults mentioned above are the first indicator that the components mounted on these PCB's may be good, since they have nothing to do with the faults. Therefore in all probability the ICs may be brand new, unused and in perfect working order.

But sometimes company policy states that these failed PCB's be send straight to landfill and recycled, this leaves a lot of potential threats, as certain people with vested interests may get the opportunity to counterfeit these components by using the scrap material from these landfills, also in some cases be sold faulty or completely degraded to unsuspecting customers who buy and implement them in their supply chain leading to  huge problems later to deal with.

  Picture used for representation purposes only

Companies were taking this risk of sending the failed PCBs straight to landfill since there was no safe way of recovering these perfectly good components from PCBs for re-use. However recently there is a process developed that can recover these components for re-use in a very safe manner and without reflow cycles, and this is certainly a much better and economical way to recycle them than to throw the full unit away.

When new components are scarce, as is often the case, their recovery becomes even more important and even more profitable. The risk of dealing in counterfeit components has increased with the 2012 US National Defence Authorization Act. As this global issue becomes more and more of a problem, the ramifications, sentences and fines are becoming increasingly severe. Therefore the best option is to recover this ICs in a safe manner for re-use.

Here is a small demonstration of the process :

          

By recovering electronic components, up to 50 times the value can be realised from the scrap. The treated scrap, with components removed, could then be sent to any recycler, thereby also eliminating counterfeiting and the re-circulation of faulty and degraded parts.

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High Reliability industries are vulnerable to counterfeit ICs

High reliability industries such as the Defence, Medical, Aerospace, Oil & Gas sectors rely on electronic parts that are no longer produced by the original manufacturers or even sold by their authorised distributors. That reliance is based, in part, on the long life cycles of these systems. An electronic part may be manufactured for two years, but many defence, medical and aerospace systems which use these parts may be in service for more than two decades. Older components often need to be properly tested and would require retinning to avoid solderability issues like tin whisker.

These high reliability industries are critically dependent on a technology that obsoletes itself every few years or even faster in some cases, is made in locations which are not secure and over which they have no market share influence. 

To source scarce parts, purchasers in these high reliability industries often buy from independent distributors or brokers. This introduces high risk of faulty or counterfeit components being acquired.

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Retronix Develop Unique Re-tinning Tool for Aerospace Customer

An Aerospace company had a large amount of LGAs with a gold pad finish that they wanted to convert to a lead finish. They wanted the re-tinning to comply with the GEIA standard, the issue was that the components were very small and any standard tooling would not have been able to perform the service on the components.

Retronix developed a very cost effective piece of tooling that held the row of the components and allowed them to be processed automatically without causing any issues.

The components were then XRF tested to verify compliance and shipped to the customer within 5 days.

Retronix 'IC Rescue' process helps maximise returns for a service repair company.

A service company that specialised in field repairs of telecommunication systems had a large quantity of spare PCBs, all brand new, that they bought in order to carry out repairs on systems. The product turned out to be far more reliable than estimated, and the product did not sell in the volumes expected.

The end result was that the service company ended up with a large quantity of brand new PCBs they had no use for, and there was no obvious external market.

Using Retronix’s “IC Rescue” process, the PCBs were stripped of valuable ICs, which were then offered to the market as 100% genuine, zero hours use ICs which were safely recovered from brand new PCBs.

These were either utilised on other PCBs which used the same chips, or sold on the general market to other companies, who knew they were recovered but also knew it was done with zero reflows and were from brand a new certified product.

This allowed the service company to maximise their return  on this product which otherwise would have returned no value, other than precious metal recovery.

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Anti Counterfeit IC Testing : Visual Inspection

As part of the Retronix Anti-Counterfeit IC testing service a customer approached us asking for our level 1 authenticity test, specifically the visual inspection service.

The customer send us approximately 3000 qty - NUD4700 type parts and asked to pick a random sample of 11 for visual inspection to check for authenticity. The reel information and datecodes given were the following: 

    Where :

  

    M = Date Code

    MNH = Device Code

    . = Pb-Free Package

The first check straight away points out certain discrepancies.  Markings do not match the information on the datasheet, and the direction of the text with reference to the Anode was found to be incorrect, further inspection about the device itself revealed the following:

As it can be seen from the datasheet image and from the image that is sourced from Mouser Electronics, the bottom side of the device should be connected to the Cathode and continue onto the entire bottom side. But as can be seen with the image of the device on the right that these devices have two isolated pins with the bottom side being the outer casing and not a contact, this shows us that the device in question is not as per standard and is considered suspect.

Continuing investigation of the device for further inspection shows:

1                                              2        

Device contacts are found to be incorrect, Anode and Cathode are formed into a gull wing as can be seen in 'Image 2' and not as they originally should have been as shown in 'Image 1'

Conclusion :

The visual inspection of the sample puts the batch as suspect and cannot be termed original as per standard datasheet and information available about the device. The report along with all photographic evidence and technical information was provided as a report to the customer as suspect counterfeit. This gives the customer a good insight into future purchases from the buyer and also this current purchase which could have caused big issues in case the customer would have gone on and implemented the same into his supply chain.

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Retronix Ltd. | Counterfeit Alert 2012 |

A customer sent approx. 5000 parts [BUK139-50DL] to check the authenticity of the components.  The customer who had procured these parts believed that the devices were originals and worked perfectly fine. He sent these parts to Retronix for Visual inspection, marking permanency testing, de-cap and a basic electrical test.

First a visual check of the label information was done and it showed on the labels attached on each reel, that the parts were lead free. Moving onto deeper visual checks on the components for the markings and the condition of the terminal told a different story. Retronix used the standard IDEA-STD-1010-B to compare the results.

Images 1 & 2 show faint indent markings and corner damage, these signs are evidence of remarking the components. Moreover there was no country of origin on the devices.

Image 3 shows further evidence that parts are remarked/sanded down as the device is uneven.











Parts on the same reel showing different DRAIN tab features, also the top part of the device was in a very poor condition

Further to this, parts from the same reel showed different DRAIN tabs, the condition of the tab was poor, deep scratches and signs of damages to the edge as shown.





The Retronix testing team then went on to perform an X-ray test of these devices for a more in depth look and as per ERAI-STD-1010-B used for as reference found the following:

The test revealed that different results of die and the drain tab, all the parts on the same reel with the same datecodes should match under the X-Ray. As was mentioned earlier the labels showed all the devices to be lead free, and in order to authenticate this the X-ray test was performed which revealed otherwise.

The de-capsulation test was then done on the devices :

Figure : Images illustrate the topside (1) and the underside (2) of the sample device. Analysis suggests no evidence of attempted re-marking or re-packaging.

The images illustrate the package markings (1) , the entire die surface (2), and the die viewed at high magnification (3) and (4) , with no known good component or information from the datasheet, the die could not be confirmed as genuine. If the information on the datasheet is to be compared to the die, then Retronix believed that there would be more internal circuitry. Moreover no Die markings were found showing part number or the manufacturer.

Further checks revealed that the parts were already reported to the ERAI, where complaints such as parts smoking exploding on the boards were being reported.

Conclusion :

With all the evidence found Retronix believed the parts to be counterfeit components and not suitable for use on PCBs due to the electrical tests that were carried out and also with the information found on the ERAI website.

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Retronix @ Electronica 2012 | Munich, Germany - Part II

The second half of Electronica became very busy as there were many visitors at the booth wanting to know about Retronix, specially services like BGA reballing, IC Recovery, Anti-Counterfeit IC Testing and Alloy Conversion which were of special interest.

The BGA Reballing video and the IC Rescue video were grabbing visitors attention and every visitor was interested in our processes which does not involve any reflows! This process is exclusively offered by Retronix and it gives the ability to recover, reball, rework without any reflows. Most of the visitors at the stand were majorly concentrated from Asia viz. China, India interested in either IC Tests or Recovery. The second half of the day there was maximum footfall keeping the booth extremely busy at all times and each representative from Retronix were occupied in talking to customers | opportunities in explaining all the various aspects about Retronix.

Word start to spread even representatives from big companies started to pop by our booth to know more about this unique process and how it could mutually benefit and bring costs down creating synergy for both corporate entities. As was planned during the whole event in the evening from 4pm onwards the whisky tasting event was organised. The second half of electronica with reference to the whisky tasting event was very popular as word had spread over the first two days about the event and therefore many more visitors dropped by at the booth for the whisky tasting event, Retronix did not mind it as the company had well anticipated the big footfall and more the visitors the better it was for the company to explain its services and discuss business over some fine Scotch. The event again was declared a resounding success as many discussions turned into real opportunities and subsequently in the future a continuing business relationship.

For Retronix, Electronica 2012 has been productive in terms of brand enhancement and also business development and this concludes the story of Electronica for 2012.

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Retronix Exhibits at the SAE 2012 Counterfeit Parts Avoidance Symposium

Retronix was one of the exhibitors at the inaugural Counterfeit Parts Avoidance Symposium held November 2^nd in Phoenix AZ. Speakers included Nicholas Torelli Jr, Director of Mission Assurance, Systems Engineering at the DoD and Phil Zulueta, Chairman of the SAE G-19 committee. Speakers discussed the growing threat of counterfeit and fraudulent ICs and components in the US supply chain and steps being taken to counter the threat.

Retronix presented its capabilities and extensive experience in Counterfeit Parts analysis, IC test and detection and its other component manufacturing services and Safe IC Recovery process for hard to source ICs.

    SAE 2012 Counterfeit Parts Avoidance Symposium

   Retronix at SAE 2012

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The Retronix advantage: Recovering and reusing ICs from scrap or obsolete PCBs

A CEM had a large customer base of complex telecoms PCBs, and found these difficult to debug if they failed after assembly. This was mainly due to their being such a large amount of revisions, the techs found it difficult to be familiar with all of them.

Subsequently there was a lot of PCB “shotgunning” going on. This was the practice of making an educated guess at what IC was causing the issue, and changing it. This meant a huge expense in ICs, most of which were thought to be fine; it would be a solder problem causing the fault (open or short under the BGA).

So they introduced an exercise of sending the removed ICs to Retronix for IC Recovery, and putting them then back into the repair loop. For IC Recovery were also sent 3^rd time failed PCBs.

This resulted in a 61% drop in IC cost in the repair area, with no noticeable difference in test yields.

All the ICs were tested electrically by Retronix before being returned.

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Retronix working with Service Repair Companies

A cell phone company manufactured its product in Asia, but had an EU Service based operation for EMEA. The service operation had small easy fix/replacement centres scattered around EMEA, but central repair facilities for PCB debug and repair issues.

It bought parts in bulk from HQ, but experienced many issues with parts shortages, over stocking and obsolete stock at the end of life for a product.

Retronix introduced a programme whereby they recovered the scrap PCBs from the company’s CEM manufacturing operations in Asia, (which were previously landfilled) and recovered the ICs locally. The recovered ICs were then shipped to the EU and held by Retronix free of charge. The service company had online access to all parts held, effectively parts held which had cost nothing, and were known genuine.

The service company would then call off parts as needed by its repair operations. At this point the parts would be refurbished using Retronix’s “IC Rescue” safe process and shipped in a few days to where they were needed. At this point Retronix would invoice for the refurbishment, which was a fraction of the cost of buying new.

The service company experienced no issues with these parts, which were brand new with zero hours use, and had been recovered using the safe “IC Rescue” process.

This successful programme slashed the parts costs of the service company, in terms of both buying and sourcing, as well as reducing obsolete costs massively.

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A possible solution to “Hard to find electronic components”, when you cannot find the new parts, on time

A USA based OEM was looking for Xilinx parts but they could not be found within the timescale. It was offered parts by a broker in China which were advertised as “refurbished”. After further investigation, the OEM found out the parts were on scrap PCBs which the broker had bought from a local CEM. However the part were still on the PCBs, and the PCBs were in ESD bags, in boxes.

The broker was planning on outsourcing the recovery and refurbishment of the BGAs to a local company in Shenzhen, however Retronix was asked by the OEM to do the BGA recovery.

IC Recovery/ IC Repair

We recovered the Xilinx parts and others from the PCBs locally in Shenzhen. This was done using our new “IC Rescue” process that recovers ICs without a reflow cycle in order to comply with the IC manufacturers’ specifications.  The parts were packed and shipped to our European facility. Shipping of the ICs only was low cost. The remainders of the PCBs were sent for recycling in Shenzhen.

BGA Reballing

Retronix then removed the excess solder from the BGAs, using a controlled process without reflow or abrasion, then cleaned the parts and immediately reballed them. The parts were mechanically & electrically inspected and packed to be shipped to the USA based OEM.

The parts were placed without any issue and zero failures were reported.

Certificate verification

The remainder of the parts were held by Retronix pending sale by the broker, and were sold with a “Retronix Certified” certificate of conformance, protecting the broker and the end user.

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