Failed PCB's - What happens to the electronic components mounted on them?

It is a fact that there will always be a certain number of failures when PCB's are manufactured and this is normal due to the nature of manufacturing processes. Typical causes that can cause failures are:

1) Paste issues

2) Raw PCB faults

3) Rogue Solder joints

These faults mentioned above are the first indicator that the components mounted on these PCB's may be good, since they have nothing to do with the faults. Therefore in all probability the ICs may be brand new, unused and in perfect working order.

But sometimes company policy states that these failed PCB's be send straight to landfill and recycled, this leaves a lot of potential threats, as certain people with vested interests may get the opportunity to counterfeit these components by using the scrap material from these landfills, also in some cases be sold faulty or completely degraded to unsuspecting customers who buy and implement them in their supply chain leading to  huge problems later to deal with.

  Picture used for representation purposes only

Companies were taking this risk of sending the failed PCBs straight to landfill since there was no safe way of recovering these perfectly good components from PCBs for re-use. However recently there is a process developed that can recover these components for re-use in a very safe manner and without reflow cycles, and this is certainly a much better and economical way to recycle them than to throw the full unit away.

When new components are scarce, as is often the case, their recovery becomes even more important and even more profitable. The risk of dealing in counterfeit components has increased with the 2012 US National Defence Authorization Act. As this global issue becomes more and more of a problem, the ramifications, sentences and fines are becoming increasingly severe. Therefore the best option is to recover this ICs in a safe manner for re-use.

Here is a small demonstration of the process :

          

By recovering electronic components, up to 50 times the value can be realised from the scrap. The treated scrap, with components removed, could then be sent to any recycler, thereby also eliminating counterfeiting and the re-circulation of faulty and degraded parts.

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Retronix- A One Stop Shop For All IC Testing and IC Repair

Retronix IC test facility is not only a one stop shop for all IC testing, we can carry out in house repair too.  From various electrical tests to detect counterfeit, to solderability and programming testing, we are equipped to test most ICs.  However with our alloy conversion & retinning services, we can repair any repairable faults.  If old ICs (QFP or BGA) have solderability issues, we can repair and verify the fix.  We can also convert from lead to lead free and vice versa.

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Retronix Ltd. | Counterfeit Alert 2012 |

A customer sent approx. 5000 parts [BUK139-50DL] to check the authenticity of the components.  The customer who had procured these parts believed that the devices were originals and worked perfectly fine. He sent these parts to Retronix for Visual inspection, marking permanency testing, de-cap and a basic electrical test.

First a visual check of the label information was done and it showed on the labels attached on each reel, that the parts were lead free. Moving onto deeper visual checks on the components for the markings and the condition of the terminal told a different story. Retronix used the standard IDEA-STD-1010-B to compare the results.

Images 1 & 2 show faint indent markings and corner damage, these signs are evidence of remarking the components. Moreover there was no country of origin on the devices.

Image 3 shows further evidence that parts are remarked/sanded down as the device is uneven.











Parts on the same reel showing different DRAIN tab features, also the top part of the device was in a very poor condition

Further to this, parts from the same reel showed different DRAIN tabs, the condition of the tab was poor, deep scratches and signs of damages to the edge as shown.





The Retronix testing team then went on to perform an X-ray test of these devices for a more in depth look and as per ERAI-STD-1010-B used for as reference found the following:

The test revealed that different results of die and the drain tab, all the parts on the same reel with the same datecodes should match under the X-Ray. As was mentioned earlier the labels showed all the devices to be lead free, and in order to authenticate this the X-ray test was performed which revealed otherwise.

The de-capsulation test was then done on the devices :

Figure : Images illustrate the topside (1) and the underside (2) of the sample device. Analysis suggests no evidence of attempted re-marking or re-packaging.

The images illustrate the package markings (1) , the entire die surface (2), and the die viewed at high magnification (3) and (4) , with no known good component or information from the datasheet, the die could not be confirmed as genuine. If the information on the datasheet is to be compared to the die, then Retronix believed that there would be more internal circuitry. Moreover no Die markings were found showing part number or the manufacturer.

Further checks revealed that the parts were already reported to the ERAI, where complaints such as parts smoking exploding on the boards were being reported.

Conclusion :

With all the evidence found Retronix believed the parts to be counterfeit components and not suitable for use on PCBs due to the electrical tests that were carried out and also with the information found on the ERAI website.

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Retronix Exhibits at the SAE 2012 Counterfeit Parts Avoidance Symposium

Retronix was one of the exhibitors at the inaugural Counterfeit Parts Avoidance Symposium held November 2^nd in Phoenix AZ. Speakers included Nicholas Torelli Jr, Director of Mission Assurance, Systems Engineering at the DoD and Phil Zulueta, Chairman of the SAE G-19 committee. Speakers discussed the growing threat of counterfeit and fraudulent ICs and components in the US supply chain and steps being taken to counter the threat.

Retronix presented its capabilities and extensive experience in Counterfeit Parts analysis, IC test and detection and its other component manufacturing services and Safe IC Recovery process for hard to source ICs.

    SAE 2012 Counterfeit Parts Avoidance Symposium

   Retronix at SAE 2012

Learn more about IC Testing here
Learn more about IC Recovery here
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Counterfeit Alert: August 2012

W83977ATG (WINBOND)

A customer sent Retronix's testing department a large number of these Winbond W83977ATG components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused, but the evidence found by our testing team revealed that the parts were not compliant with standards set by IDEA-STD-1010B, Exhibit 46B Figure 12-79, Coplanarity Failures.

The parts arrived in non-moisture bags, meaning that if they were going to be used, they would need to be baked beforehand to remove any moisture. Some of the components which were visually inspected by the testing team at Retronix also showed signs of contamination. Upon opening the first bag of components, Retronix's testing team noticed obvious damage to the top left component.

Top tray of first bag opened - visible damage to top left device.

Closer inspection of the devices uncovered contamination on the back of the component and damage to the pins. 

Left - contamination on back of device. Right - pin damage to device.

Although some of the components displayed differing pin 1 indents, this may have been because the batches had mixed datecodes. This theory would need to be verified by Winbond.

THE VERDICT

Due to the initial results of the visual inspection, as well as the more detailed results - which revealed pin damage and contamination - Retronix's testing team has ruled the components to be in "non-conforming condition."

CS5530AUCE (National Semiconductor)

Retronix's testing department were sent CS5530AUCE Geode components with the request that they be visually inspected before use, much like the above Winbond case. These components were also sold as new and unused. 

But as soon as the testing department opened the box containing the components, they knew that these components were not what they said on the label. As you can see, although these components are on the same tray and have the same markings, they have different pin 1 indents and different top side edges.

The visible differences in the shapes and pin indents of the devices.

Upon closer inspection, Retronix's testing team discovered that the components had several scratch marks on their surfaces and signs of liquid contamination on the solder spheres.

Left - scratches and evidence of re-balling. Right - liquid contamination on spheres.

 The CS5530AUCE Geode components also displayed evidence of being re-balled.

THE VERDICT

The visual inspection revealed a number of anomalies and the more detailed results of the tests uncovered yet more unusual features in these components, such as scratches and sphere contamination. Accordingly, Retronix's testing team has ruled the components to be in "non-conforming condition."

MPC866PVR133A (FREESCALE)

A customer sent Retronix's testing team a batch of Freescale MPC866PVR133A components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused.

When inspecting the packaging that the components had been delivered to Retronix's customer in, the testing team discovered that the label contained no manufacturer information or logo. 

Packaging label is missing manufacturer's logo and information.

The components were then removed from the packaging and examined visually. This inspection uncovered a problem in the device's solder spheres - the spheres were scratched from underneath.

Visual inspection at Retronix uncovered scratches beneath solder spheres.

The only way that scratches beneath solder spheres can occur is if the solder spheres have been removed, meaning that it is very likely that this component had been re-balled - despite the fact that it was sold to our customer as "new and unused."

Further testing by Retronix also revealed that the device's solder spheres had evidence of contamination. Unfortunately, this was not the last of the component's flaws - the tests also showed that different sizes of solder sphere had been used to reball the device.

Left - solder sphere contamination. Right - different sphere sizes used.

Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres.

THE VERDICT

Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres. This, coupled with the poor packaging which the components arrived in, has led Retronix's testing department to the conclusion that these components are "suspect counterfeit."

Worried about the authenticity of your components? Retronix can help. 

Counterfeit Alert: June 2012

LSI53C1000R (LSI)

During the initial visual inspection, our testing department became suspicious straight away - the manufacturer's name was spelt incorrectly on the components and the date codes were varied when they should not have been. The markings, which should state "LSI LOGIC," actually say "LSI LOGIG." Our Test Manager, Joe Maguire, contacted LSI about the components and they responded with:

Markings display "LSI LOGIG" rather than "LSI LOGIC."

"Sample parts of the LSI53C1000R that we have on hand in the quality archives show the part marking to only include the word 'LSI' - not 'LSI LOGIC'... There is nothing on file for a correction of the markings from LSI LOGIG to LSI LOGIC."


Further examination from Retronix's testing department revealed that the components had chipped edges, fibre contamination and scratches under the solder spheres - all tell-tale signs of counterfeiting.

Retronix's testing department discovered fibre contamination in the components.

To confirm their suspicions about the authenticity of the parts, our testing department carried out XRF tests. The XRF analysis results showed that all of the components tested had a Pb (lead) content of over 24%, meaning that they were leaded and not RoHS compliant.

THE VERDICT

The results of the visual inspections and XRF analysis, along with LSI's statement, led Retronix's testing department to the conclusion that the parts should be regarded as "suspect counterfeit."

GM71V65163CT-3 (HYNIX)

Visual inspections revealed that two of the Hynix components tested had different textures - one had a smooth surface and reflected light while the other was bumpy and dull in its appearance.

Following this discovery, the testing team at Retronix subjected the components to permanency marking tests. Using a mixture consisting of one part IPA and three parts mineral spirits, a wipe test was performed. This resulted in a slight fading of the markings.

Markings changed from "Hyundai" to "Hynix."

Wipe testing using acetone uncovered another issue with the components - the date codes had been altered. The acetone wipe test also proved that the components had been re-marked. Changing date codes and branding is another trick used by counterfeiters to mask the origins of inauthentic parts.

Hynix were formerly Hyundai, however these may have been rebranded by counterfeiters  in an attempt to pass them off as authentic.

THE VERDICT

Due to the differences in surface appearance between components and the altering of the date codes and branding, Retronix's testing team has classed these as "suspect counterfeit."

MT29F08G08AAWP (MICRON)

Upon initial inspection, there are no obvious attempts at re-marking or re-packaging. However, Retronix's testing team notes that the markings on the die are Intel, not Micron. 

After further investigation through de-cap testing, it is discovered that while the device is marked as a Micron 8GB device, the die is marked as an Intel 16GB device. Furthermore, the date code on the device is 2009, week 16, while the date code on the die is 2008.

The true origins of the device are revealed through de-cap testing.

Retronix's testing department then used a programming software which is compatible with the MT29F08G08AAWP device to determine its unique ID code. This is a simple test which any genuine component would easily pass. The results proved that the device code was not authentic.

After contacting Micron about the component, our team received the following statement, confirming their suspicions about the device:

"The Micron part number is for an obsolete product and the die inside the package is for a different part."

THE VERDICT

Although this component did not display any external signs of tampering, the de-cap testing and incorrect ID code - along with Micron's statement - have allowed Retronix to confirm that this component is most definitely a counterfeit device.

Worried about the authenticity of your components? Retronix can help. 

Investing in the Future: Automated Re-tinning

Importance of Re-tinning

In the PCB industry, the importance of re-tinning components prior to assembly is widely recognised. The way in which the re-tinning process is carried out is often crucial to the reliability of the components. Operator errors can cause damage to fine pitch leads and produce inconsistent results, so it is essential that the re-tinning process is automated.

Automated Processes for Optimal Results

Retronix's specialised services are designed to provide our customers with the most reliable and consistent results possible. With this in mind, we are pleased to announce that we have given our final sign off on our brand-new automated re-tinning machine!

Retronix's Operations Manager, Calum Drummond, receives final sign-off certificate from ACE Production Technology's President, Alan Cable.

The machine is an LTS-QFP system which is being custom built to our specifications which will provide automated re-tinning processing in accordance with ANSI/GEIA-STD-0006-2008 standards. It is equipped with:

• Articulated vacuum pick-up head
• Matrix tray (JEDEC)
• Camera centring station
• Lead alloy compatible solder pots (x2)
• Fluxing station
• Preheating station
• Washing station
• Drying station 

This "hands off" approach will allow for automated solder dip coating of fine pitch QFPs and similar devices and will produce consistently reliable results. 

Retronix's Guarantee

All components which pass through Retronix are subjected to thorough automated optical inspection testing and you only pay for the components which PASS our strict inspection criteria. 

To find out more about our component re-tinning services, please visit our website. 

Retronix Leads with Revolutionary Process

Unique and Innovative Process

Retronix's proven IC recovery process is the ONLY way to safely recover ICs from faulty and obsolete PCBs. Every day, companies waste huge amounts of money by scrapping faulty PCBs rather than recycling them. Why? Because there has never been a risk-free and reliable way to recover high-value ICs - until now.

IC manufacturers' specifications state that components can be subjected to no more than three reflow cycles. Our process allows us to safely remove and refurbish components with zero reflow cycles.

Comparison of current IC recovery processes and Retronix's IC recovery process.

Benefits of Recycling ICs

When PCBs fail in assembly, it is mainly due to process issues such as defective solder joints and raw PCB faults rather than silicon faults. Recycling ICs from failed PCBs with Retronix allows you to:

• SLASH PRODUCTION COSTS - By recovering and re-using high-value ICs, you can save up to 80% of the cost of scrap and obsolete PCBs
• FIND RARE COMPONENTS - Recovering ICs gives you with a new source of rare components. Retronix can recover scarce components from faulty or obsolete PCBs, providing you with a supply of safe and authentic ICs
• BEAT COUNTERFEITING CONCERNS - The counterfeit industry is growing at an alarming rate. Removing and refurbishing components with Retronix prevents parts from entering the grey market and allows them to be thoroughly tested and certified (providing they pass our strict standards) before re-use or resale
• REDUCE LANDFILL MATERIAL - Recycling components (which often contain harmful chemicals) rather than sending them to landfill doesn't just save you money - it also saves the environment

Read more about how Retronix's revolutionary process can help you recover ICs safely and save you money.