The Retronix advantage: Recovering and reusing ICs from scrap or obsolete PCBs

A CEM had a large customer base of complex telecoms PCBs, and found these difficult to debug if they failed after assembly. This was mainly due to their being such a large amount of revisions, the techs found it difficult to be familiar with all of them.

Subsequently there was a lot of PCB “shotgunning” going on. This was the practice of making an educated guess at what IC was causing the issue, and changing it. This meant a huge expense in ICs, most of which were thought to be fine; it would be a solder problem causing the fault (open or short under the BGA).

So they introduced an exercise of sending the removed ICs to Retronix for IC Recovery, and putting them then back into the repair loop. For IC Recovery were also sent 3^rd time failed PCBs.

This resulted in a 61% drop in IC cost in the repair area, with no noticeable difference in test yields.

All the ICs were tested electrically by Retronix before being returned.

If you want to learn more, please contact us here

Watch the video about IC Recovery here

Retronix working with Service Repair Companies

A cell phone company manufactured its product in Asia, but had an EU Service based operation for EMEA. The service operation had small easy fix/replacement centres scattered around EMEA, but central repair facilities for PCB debug and repair issues.

It bought parts in bulk from HQ, but experienced many issues with parts shortages, over stocking and obsolete stock at the end of life for a product.

Retronix introduced a programme whereby they recovered the scrap PCBs from the company’s CEM manufacturing operations in Asia, (which were previously landfilled) and recovered the ICs locally. The recovered ICs were then shipped to the EU and held by Retronix free of charge. The service company had online access to all parts held, effectively parts held which had cost nothing, and were known genuine.

The service company would then call off parts as needed by its repair operations. At this point the parts would be refurbished using Retronix’s “IC Rescue” safe process and shipped in a few days to where they were needed. At this point Retronix would invoice for the refurbishment, which was a fraction of the cost of buying new.

The service company experienced no issues with these parts, which were brand new with zero hours use, and had been recovered using the safe “IC Rescue” process.

This successful programme slashed the parts costs of the service company, in terms of both buying and sourcing, as well as reducing obsolete costs massively.

If you want to learn more, please contact us here

A possible solution to “Hard to find electronic components”, when you cannot find the new parts, on time

A USA based OEM was looking for Xilinx parts but they could not be found within the timescale. It was offered parts by a broker in China which were advertised as “refurbished”. After further investigation, the OEM found out the parts were on scrap PCBs which the broker had bought from a local CEM. However the part were still on the PCBs, and the PCBs were in ESD bags, in boxes.

The broker was planning on outsourcing the recovery and refurbishment of the BGAs to a local company in Shenzhen, however Retronix was asked by the OEM to do the BGA recovery.

IC Recovery/ IC Repair

We recovered the Xilinx parts and others from the PCBs locally in Shenzhen. This was done using our new “IC Rescue” process that recovers ICs without a reflow cycle in order to comply with the IC manufacturers’ specifications.  The parts were packed and shipped to our European facility. Shipping of the ICs only was low cost. The remainders of the PCBs were sent for recycling in Shenzhen.

BGA Reballing

Retronix then removed the excess solder from the BGAs, using a controlled process without reflow or abrasion, then cleaned the parts and immediately reballed them. The parts were mechanically & electrically inspected and packed to be shipped to the USA based OEM.

The parts were placed without any issue and zero failures were reported.

Certificate verification

The remainder of the parts were held by Retronix pending sale by the broker, and were sold with a “Retronix Certified” certificate of conformance, protecting the broker and the end user.

If you want to learn more, please contact us here

IC Recovery: Retronix “IC Rescue” process in action

With the demise of Nortel, it has left existing users with a problem if they want to expand their existing Nortel telecoms telephone system – where do they get the hardware?

Flextronics were tasked with supplying a daughter board for an exchange, and could source all the parts apart from one – the Nortel processor itself.

The part was a NT6X54AA ASIC, long since out of production. The only alternative at the time was to set up a production run to make a batch of chips – however this was a massive cost.

Then it was discovered that although the revision of daughter board needed did not exist, earlier revisions of the board existed in quite large numbers – and the only constant between all the revisions was the ASIC chip!

So Retronix was asked to carry out a recovery operation on the chips so they could be re-used.

Retronix used their unique IC Rescue process to remove and refurbish the ASIC chips without using any dangerous heat or abrasive processes. All chips were then fully tested, both mechanically and electrically, and supplied to the CEM to be installed on the latest revision of PCB.

This proved a highly successful operation, with no reported field failures after 2 years of installation.

For further info on how Retronix can help you recover chips for reuse, to either save money, the environment or because you cant source them, email us at info@retronix.com

Safe Recovery White Paper: Learn more about Retronix Zero Reflow Cycles Process for IC Rescue by clicking here.

Counterfeit Alert: August 2012

W83977ATG (WINBOND)

A customer sent Retronix's testing department a large number of these Winbond W83977ATG components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused, but the evidence found by our testing team revealed that the parts were not compliant with standards set by IDEA-STD-1010B, Exhibit 46B Figure 12-79, Coplanarity Failures.

The parts arrived in non-moisture bags, meaning that if they were going to be used, they would need to be baked beforehand to remove any moisture. Some of the components which were visually inspected by the testing team at Retronix also showed signs of contamination. Upon opening the first bag of components, Retronix's testing team noticed obvious damage to the top left component.

Top tray of first bag opened - visible damage to top left device.

Closer inspection of the devices uncovered contamination on the back of the component and damage to the pins. 

Left - contamination on back of device. Right - pin damage to device.

Although some of the components displayed differing pin 1 indents, this may have been because the batches had mixed datecodes. This theory would need to be verified by Winbond.

THE VERDICT

Due to the initial results of the visual inspection, as well as the more detailed results - which revealed pin damage and contamination - Retronix's testing team has ruled the components to be in "non-conforming condition."

CS5530AUCE (National Semiconductor)

Retronix's testing department were sent CS5530AUCE Geode components with the request that they be visually inspected before use, much like the above Winbond case. These components were also sold as new and unused. 

But as soon as the testing department opened the box containing the components, they knew that these components were not what they said on the label. As you can see, although these components are on the same tray and have the same markings, they have different pin 1 indents and different top side edges.

The visible differences in the shapes and pin indents of the devices.

Upon closer inspection, Retronix's testing team discovered that the components had several scratch marks on their surfaces and signs of liquid contamination on the solder spheres.

Left - scratches and evidence of re-balling. Right - liquid contamination on spheres.

 The CS5530AUCE Geode components also displayed evidence of being re-balled.

THE VERDICT

The visual inspection revealed a number of anomalies and the more detailed results of the tests uncovered yet more unusual features in these components, such as scratches and sphere contamination. Accordingly, Retronix's testing team has ruled the components to be in "non-conforming condition."

MPC866PVR133A (FREESCALE)

A customer sent Retronix's testing team a batch of Freescale MPC866PVR133A components and requested a visual inspection to determine their condition prior to use. The devices were bought as new and unused.

When inspecting the packaging that the components had been delivered to Retronix's customer in, the testing team discovered that the label contained no manufacturer information or logo. 

Packaging label is missing manufacturer's logo and information.

The components were then removed from the packaging and examined visually. This inspection uncovered a problem in the device's solder spheres - the spheres were scratched from underneath.

Visual inspection at Retronix uncovered scratches beneath solder spheres.

The only way that scratches beneath solder spheres can occur is if the solder spheres have been removed, meaning that it is very likely that this component had been re-balled - despite the fact that it was sold to our customer as "new and unused."

Further testing by Retronix also revealed that the device's solder spheres had evidence of contamination. Unfortunately, this was not the last of the component's flaws - the tests also showed that different sizes of solder sphere had been used to reball the device.

Left - solder sphere contamination. Right - different sphere sizes used.

Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres.

THE VERDICT

Solder sphere contamination is a tell-tale sign of a suspect device - as is different sized solder spheres. This, coupled with the poor packaging which the components arrived in, has led Retronix's testing department to the conclusion that these components are "suspect counterfeit."

Worried about the authenticity of your components? Retronix can help. 

New Faces at Retronix

Retronix Expands Marketing Department

These are exciting times for Retronix and the electronic component recovery company is committed to an expansion in its activities. This year has seen major investments in capital expenditure and the development of unique processes for IC recovery (IC Rescue) and automated re-tinning. 

We have developed a new website and expanded our marketing team by recruiting three exceptional graduates. Our new team members, who are based in our Coatbridge facility, have hit the ground running and are certainly being kept busy! Allow us to introduce you to them...

Maulin Buch, Marketing Executive

Maulin Buch

Maulin graduated from the University of Glasgow with a MSc degree in Strategic Marketing in 2011. 

He worked as a Marketing Manager at Tech Solutions and as a Channel Sales Executive at Sanofi Aventis before joining us at Retronix. His specialities are branding management and strategic planning. 

Maulin said: "Working at Retronix is interesting in so many ways. The electronics sector is new to me and learning new things every day about the business makes each day of work exciting - our dynamic team and friendly work environment make it even better. Becoming a part of this marketing team cannot have come at a better time for me."

Connect with Maulin on LinkedIn

Eirini Chavgie, Marketing Executive

Eirini Chavgie

Eirini received a MSc degree in Strategic Marketing from the University of Glasgow in 2011. 

After graduating, Eirini lent her skills to an online magazine as a Marketing Assistant before securing her position at Retronix. She specialises in market research and brand analysis. 

Eirini said: "Being a part of Retronix's marketing team presents new challenges every day and I am constantly learning about the electronics sector and developing my understanding of it. Creating marketing strategies around this knowledge is what makes working at Retronix very rewarding for me."

Connect with Eirini on LinkedIn

Rachel Boyle, Marketing Executive

Rachel Boyle

Rachel secured a BA (Hons) degree in Marketing from Glasgow Caledonian University in June 2012. 

Before becoming part of Retronix's marketing team, Rachel worked as an Assistant Brand Manager at The White Matter and a Graduate Market Researcher at JBD Tritec. Her specialities include market analysis and customer communication. 

Rachel said: "Since I started at Retronix, I have developed my understanding of the electronics market and Retronix's positioning within this market. I'm eager to build on my previous experience in market planning to help steer the business through the exciting times ahead!"

Connect with Rachel on LinkedIn

The graduates join existing marketing team member Caitlin King, who also has experience in public relations. Her specialities are copywriting and social media management.

Please visit our website to find out more about Retronix's other team members or contact us to find out more about our services.

Counterfeit Alert: June 2012

LSI53C1000R (LSI)

During the initial visual inspection, our testing department became suspicious straight away - the manufacturer's name was spelt incorrectly on the components and the date codes were varied when they should not have been. The markings, which should state "LSI LOGIC," actually say "LSI LOGIG." Our Test Manager, Joe Maguire, contacted LSI about the components and they responded with:

Markings display "LSI LOGIG" rather than "LSI LOGIC."

"Sample parts of the LSI53C1000R that we have on hand in the quality archives show the part marking to only include the word 'LSI' - not 'LSI LOGIC'... There is nothing on file for a correction of the markings from LSI LOGIG to LSI LOGIC."


Further examination from Retronix's testing department revealed that the components had chipped edges, fibre contamination and scratches under the solder spheres - all tell-tale signs of counterfeiting.

Retronix's testing department discovered fibre contamination in the components.

To confirm their suspicions about the authenticity of the parts, our testing department carried out XRF tests. The XRF analysis results showed that all of the components tested had a Pb (lead) content of over 24%, meaning that they were leaded and not RoHS compliant.

THE VERDICT

The results of the visual inspections and XRF analysis, along with LSI's statement, led Retronix's testing department to the conclusion that the parts should be regarded as "suspect counterfeit."

GM71V65163CT-3 (HYNIX)

Visual inspections revealed that two of the Hynix components tested had different textures - one had a smooth surface and reflected light while the other was bumpy and dull in its appearance.

Following this discovery, the testing team at Retronix subjected the components to permanency marking tests. Using a mixture consisting of one part IPA and three parts mineral spirits, a wipe test was performed. This resulted in a slight fading of the markings.

Markings changed from "Hyundai" to "Hynix."

Wipe testing using acetone uncovered another issue with the components - the date codes had been altered. The acetone wipe test also proved that the components had been re-marked. Changing date codes and branding is another trick used by counterfeiters to mask the origins of inauthentic parts.

Hynix were formerly Hyundai, however these may have been rebranded by counterfeiters  in an attempt to pass them off as authentic.

THE VERDICT

Due to the differences in surface appearance between components and the altering of the date codes and branding, Retronix's testing team has classed these as "suspect counterfeit."

MT29F08G08AAWP (MICRON)

Upon initial inspection, there are no obvious attempts at re-marking or re-packaging. However, Retronix's testing team notes that the markings on the die are Intel, not Micron. 

After further investigation through de-cap testing, it is discovered that while the device is marked as a Micron 8GB device, the die is marked as an Intel 16GB device. Furthermore, the date code on the device is 2009, week 16, while the date code on the die is 2008.

The true origins of the device are revealed through de-cap testing.

Retronix's testing department then used a programming software which is compatible with the MT29F08G08AAWP device to determine its unique ID code. This is a simple test which any genuine component would easily pass. The results proved that the device code was not authentic.

After contacting Micron about the component, our team received the following statement, confirming their suspicions about the device:

"The Micron part number is for an obsolete product and the die inside the package is for a different part."

THE VERDICT

Although this component did not display any external signs of tampering, the de-cap testing and incorrect ID code - along with Micron's statement - have allowed Retronix to confirm that this component is most definitely a counterfeit device.

Worried about the authenticity of your components? Retronix can help.